Hot Products
China DCX800 Diamond Single Wire Cutting Equipment - High-Precision Suppliers and Factory for Sapphire and Optical Glass
Product Features
Optimized Swing Cutting Technology
Reduces material waste by 15% with a patented diamond wire oscillation system, ideal for intricate cuts on fragile materials.
Space-Saving Design
Tailored for workshops with limited floor space, featuring an 800x800x800mm workpiece capacity.
Lab-Grade Precision
Integrated laser alignment sensors ensure ±0.05mm cutting accuracy, critical for optical components and electronics.
Energy Efficiency
Consumes 20% less power than industry standards, lowering operational costs.
Smart Error Recovery
Automatically resumes cutting after wire breaks, minimizing downtime.
Applications
Semiconductor wafer dicing, custom jewelry and gemstone processing, and prototyping optical lenses or sensors.
Technical Parameters
| Project | Content | Technical parameters |
| Model | Model | DCX800 |
| Processing capacity | Max processing billet size | 800×800×800mm |
| Number of stations | 1 | |
| Workbench size | 860X1200mm | |
| Diamond Wire | Diamond wire diameter | Ф0.25-φ0.60 |
| Max line storage capacity | 20 km (φ0.25mm) | |
| Max round-trip routing speed | 1200 m/min | |
| Cutting method | Cutting method | The cutting line drops in parallel or rocking down |
| Max line swing angle | ±30° | |
| Rotary cutting (with rotating tooling) | Rotating cutting, maximum sample size 8 inches, 360° rotation | |
| Cutting fluid | Cutting fluid | Water-based or oil-based cutting fluid |
| Liquid storage capacity | 223L | |
| Pump flow | 200L/min | |
| Power supply | Power supply | 380V±10%、50Hz |
| Power | 15 Kw | |
| Dimensions and weight | Dimensions (L x W x H) | 2510 × 2700 ×2500 mm |
| Weight | 5000 Kg |
Frequently Asked Questions
What is the cutting accuracy of the DCX800 cutting equipment?
The equipment offers lab-grade precision, utilizing integrated laser alignment sensors to guarantee a cutting accuracy of ±0.05mm, which is critical for optical components and sensitive electronics.
What is the maximum workpiece size that can be processed?
Despite its space-saving design, the machine features a large processing capacity that can accommodate a maximum billet size of 800×800×800mm on a workbench measuring 860X1200mm.
How does the swing cutting technology help reduce material waste?
The machine features an Optimized Swing Cutting Technology powered by a patented diamond wire oscillation system. This design reduces material waste by 15% and is highly suited for making intricate cuts on fragile materials.
What cutting methods and wire specifications does the system support?
It supports parallel or rocking down cutting methods with a maximum line swing angle of ±30°, as well as 360° rotating cutting for samples up to 8 inches. It uses diamond wires with diameters ranging from Ф0.25 to φ0.60mm.
What safety or recovery features are integrated in case of wire breaks?
The machine is equipped with a Smart Error Recovery feature, which automatically resumes the cutting path after wire breaks, significantly minimizing operational downtime.