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High-Precision DCX800 Diamond Single Wire Cutting Equipment - China Suppliers & Factory for Sapphire and Optical Glass
Product Features
Optimized Swing Cutting Technology: Reduces material waste by 15% with a patented diamond wire oscillation system, ideal for intricate cuts on fragile materials.
Space-Saving Design: Tailored for workshops with limited floor space, featuring an 800x800x800mm workpiece capacity.
Lab-Grade Precision: Integrated laser alignment sensors ensure ±0.05mm cutting accuracy, critical for optical components and electronics.
Energy Efficiency: Consumes 20% less power than industry standards, lowering operational costs.
Smart Error Recovery: Automatically resumes cutting after wire breaks, minimizing downtime.
Applications: Semiconductor wafer dicing, custom jewelry and gemstone processing, and prototyping optical lenses or sensors.
Technical Parameters
| Project | Content | Technical Parameters |
| Model | Model | DCX800 |
| Processing capacity | Max processing billet size | 800×800×800mm |
| Number of stations | 1 | |
| Workbench size | 860X1200mm | |
| Diamond Wire | Diamond wire diameter | Ф0.25-φ0.60 |
| Max line storage capacity | 20 km (φ0.25mm) | |
| Max round-trip routing speed | 1200 m/min | |
| Cutting method | Cutting method | Parallel or rocking down |
| Max line swing angle | ±30° | |
| Rotary cutting | Rotating cutting, max sample size 8 inches, 360° rotation | |
| Cutting fluid | Cutting fluid | Water-based or oil-based |
| Liquid storage capacity | 223L | |
| Pump flow | 200L/min | |
| Power supply | Power supply | 380V±10%、50Hz |
| Power | 15 Kw | |
| Dimensions | Dimensions (L x W x H) | 2510 × 2700 × 2500 mm |
| Weight | 5000 Kg |
Frequently Asked Questions
What is the maximum workpiece size for the DCX800?
The DCX800 can handle a maximum processing billet size of 800×800×800mm, supported by a workbench size of 860x1200mm.
What level of cutting precision does this equipment offer?
The equipment features lab-grade precision with integrated laser alignment sensors that ensure a cutting accuracy of ±0.05mm.
Can the machine handle wire breaks during operation?
Yes, the DCX800 is equipped with Smart Error Recovery technology which allows it to automatically resume cutting after a wire break, minimizing downtime.
What types of cutting fluids are compatible?
The system is versatile and can utilize either water-based or oil-based cutting fluids, depending on the material requirements.
How does the swing cutting technology improve efficiency?
The patented diamond wire oscillation (swing cutting) reduces material waste by approximately 15% and is particularly effective for fragile materials.
What are the main applications for the DCX800?
It is ideal for semiconductor wafer dicing, custom jewelry and gemstone processing, and prototyping high-precision optical lenses or sensors.