English
English French German Portuguese Spanish Russian Japanese Korean Arabic Turkish Italian Indonesian Polish Hindi Dutch Malay Persian Thai Vietnamese
Leave Your Message
High-Precision DCX800 Diamond Wire Cutting Machine from China Suppliers | Ideal for Factory Use
Hot Products
Diamond-Single-Wire-Cutting-Equipment-DCX800.jpg
image002.jpg

High-Precision DCX800 Diamond Wire Cutting Machine from China Suppliers | Ideal for Factory Use

The DCX800 Single-Wire Cutting Machine is a state-of-the-art solution tailored for industries in China that demand high-precision cutting of ultra-hard materials such as sapphire, optical glass, and jade. This advanced machine utilizes a diamond-coated wire that oscillates during operation, significantly minimizing the effective cutting width for remarkably clean and controlled separations. Ideal for suppliers seeking efficient tools for smaller production facilities or R&D labs, its compact yet durable design ensures maximum efficiency without sacrificing precision. Optimize your cutting processes with the DCX800 and elevate your manufacturing capabilities in your factory
    Contact Us
    Product Detail

    Product Features

    Diamond Single Wire Cutting Equipment DCX8001

    Released: 7 Jan 2019

    Optimized Swing Cutting Technology Reduces material waste by 15% with a patented diamond wire oscillation system, ideal for intricate cuts on fragile materials.
    Space-Saving Design Tailored for workshops with limited floor space, featuring an 800x800x800mm workpiece capacity.
    Lab-Grade Precision Integrated laser alignment sensors ensure ±0.05mm cutting accuracy, critical for optical components and electronics.
    Energy Efficiency Consumes 20% less power than industry standards, lowering operational costs.
    Smart Error Recovery Automatically resumes cutting after wire breaks, minimizing downtime.
    Applications Semiconductor wafer dicing, custom jewelry and gemstone processing, and prototyping optical lenses or sensors.

    Technical Parameters

    Project Content Technical Parameters
    Model Model DCX800
    Processing capacity Max processing billet size 800×800×800mm
    Number of stations 1
    Workbench size 860X1200mm
    Diamond Wire Diamond wire diameter Ф0.25-φ0.60
    Max line storage capacity 20 km (φ0.25mm)
    Max round-trip routing speed 1200 m/min
    Cutting method Cutting method The cutting line drops in parallel or rocking down
    Max line swing angle ±30°
    Rotary cutting Rotating cutting, maximum sample size 8 inches, 360° rotation
    Cutting fluid Cutting fluid Water-based or oil-based cutting fluid
    Liquid storage capacity 223L
    Pump flow 200L/min
    Power supply Power supply 380V±10%、50Hz
    Power 15 Kw
    Dimensions and weight Dimensions (L x W x H) 2510 × 2700 × 2500 mm
    Weight 5000 Kg
    Technical Drawing

    Frequently Asked Questions

    What is the cutting precision of the DCX800?
    The equipment features lab-grade precision with integrated laser alignment sensors, ensuring a cutting accuracy of ±0.05mm.
    What are the main applications for this diamond wire saw?
    It is widely used for semiconductor wafer dicing, custom jewelry and gemstone processing, and prototyping optical lenses or sensors.
    How does the "Smart Error Recovery" feature benefit the user?
    It automatically resumes the cutting process after a wire break, which minimizes downtime and protects the workpiece from damage.
    What types of cutting fluids are compatible with this machine?
    The DCX800 is versatile and can operate with either water-based or oil-based cutting fluids depending on the material requirements.
    Is the DCX800 suitable for small workshops?
    Yes, it features a space-saving design specifically tailored for workshops with limited floor space while maintaining a large 800x800x800mm capacity.
    What are the power requirements for operation?
    The machine requires a 380V±10% (50Hz) power supply and has a total power consumption of 15 Kw.

    Leave Your Message