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Premium Diamond Wire Cutting Tool from China Suppliers & Factory for High-Precision Multi-Wire Applications
Product Features
7 Jan 2019
High Efficiency
Achieves cutting efficiency more than three times that of traditional cutting methods, significantly reducing cutting time.
Environmental Protection
Eliminates the need for mortar, simplifying the waste treatment process and enhancing environmental friendliness.
High Precision
Ensures a high yield of finished products with exceptional processing precision.
Cost Reduction
Lowers investment in fixed assets, reducing the required investment in cutting equipment by more than 50% for the same capacity.
Diamond wire for cutting magnets to cut magnets into pieces or blocks
Diamond wire for cutting silicon to cut silicon and semiconductor materials into straight sheets
Diamond wire for cutting sapphire to cut sapphire, magnets, glasses into straight sheets
Technical Parameters
| SPEC | Wire diameter（μm） | Busbar Diameter（μm） | Breaking tension（N） | Application Areas |
| Φ55 | 70±5 | 55±2 | ≥11 | Semiconductor material cutting |
| Φ60 | 75±5 | 60±2 | ≥13 | |
| Φ70 | 80±5 | 70±2 | ≥17 | |
| Φ80 | 90±5 | 80±2 | ≥20 | |
| Φ90 | 100±5 | 90±2 | ≥28 | |
| Φ100 | 110±5 | 100±2 | ≥30 | |
| Φ110 | 120±5 | 110±2 | ≥34 | |
| Φ80 | 80±5 | 60±2 | ≥13 | Rare earth magnets, optical glass, silicon carbide cutting |
| Φ90 | 90±5 | 70±2 | ≥17 | |
| Φ100 | 110±5 | 80±2 | ≥22 | |
| Φ110 | 115±5 | 85±2 | ≥22 | |
| Φ120 | 120±5 | 90±2 | ≥28 | |
| Φ140 | 145±5 | 100±2 | ≥30 | |
| Φ150 | 150±10 | 110±2 | ≥35 | |
| Φ160 | 160±10 | 110±2 | ≥35 | |
| Φ170 | 170±10 | 120±3 | ≥40 | |
| Φ180 | 180±10 | 125±3 | ≥44 | |
| Φ190 | 190±10 | 135±3 | ≥50 | |
| Φ200 | 200±10 | 140±3 | ≥55 | |
| Φ220 | 220±10 | 160±3 | ≥70 | |
| Φ230 | 230±10 | 170±3 | ≥75 | Functional ceramics, alloy materials, sapphire cutting |
| Φ250 | 250±10 | 180±3 | ≥88 | |
| Φ270 | 270±20 | 200±3 | ≥130 | |
| Φ300 | 300±20 | 240±3 | ≥160 | Crystalline Silicon, Jade, Sapphire Open Square Truncation |
| Φ350 | 350±20 | 260±3 | ≥185 | |
| Φ380 | 380±25 | 300±3 | ≥230 | |
| Φ450 | 450±25 | 350±3 | ≥300 |
Note: 1. Special specifications can be customized according to customer needs; 2. The actual parameter values of the specifications determined by both parties shall prevail.
Application Fields
Semiconductor
Microcrystalline Glass
Sapphire
Silicon Carbide Crystals
Rare Earth Materials
Frequently Asked Questions
What are the key advantages of your diamond cutting wire?
Our diamond cutting wire delivers over three times the efficiency of traditional methods, features eco-friendly operation by eliminating the need for mortar, guarantees exceptional precision for high-yield outputs, and reduces overall cutting equipment investment by more than 50%.
What materials are compatible with this diamond cutting wire?
It is widely applied in cutting semiconductor materials, rare earth magnets, optical glass, silicon carbide crystals, sapphire, functional ceramics, alloy materials, jade, and crystalline silicon.
Can I request custom technical specifications?
Yes. We can customize special specifications according to specific customer requirements. The final parameter standards are determined and agreed upon by both parties.
How does the environmental protection design work?
By eliminating the need for mortar during the cutting process, our technology simplifies the waste treatment process, reduces environmental hazards, and creates a cleaner production environment.
What is the typical breaking tension range for your wires?
The breaking tension varies depending on wire diameter, ranging from ≥11 N for thin semiconductor wires (e.g., Φ55) up to ≥300 N for larger crystalline silicon truncation wires (e.g., Φ450).