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Premium Diamond Wire Cutting Tools from China Suppliers and Factory for High-Precision Applications

Introducing our premium Diamond Wire, a cutting-edge tool designed for high-efficiency performance, manufactured in our state-of-the-art factory in China. This innovative product combines high carbon steel wire with meticulously bonded diamond particles using a durable metal binding agent, making it the ideal choice for processing hard and brittle materials such as silicon, semiconductor wafers, sapphires, rare-earth permanent magnets, alloys, and luxurious stones. With versatile applications across diverse industries like aerospace, photovoltaic, semiconductor, LED, 3C (computers, communications, and consumer electronics), and precision optics, our diamond wire stands out among other suppliers in the market.

Made with high-quality, high-concentration diamond micro-powder and top-grade high carbon steel wire imported from Japan, our diamond wire guarantees exceptional performance and consistent quality. It features rapid cutting speeds, impressive processing precision, and minimal cutting loss, ultimately contributing to a more sustainable and eco-friendly production environment for our clients. Choose our Diamond Wire for reliable quality and outstanding results in your cutting applications.

Product Detail

Product Features

Updated: 7 Jan 2019

High Efficiency Achieves cutting efficiency more than three times that of traditional methods, significantly reducing processing time.

Environmental Protection Eliminates the need for mortar, simplifying waste treatment and enhancing eco-friendliness.

High Precision Ensures a high yield of finished products with exceptional processing precision and surface quality.

Cost Reduction Lowers fixed asset investment by over 50% compared to traditional cutting equipment for the same capacity.

Diamond wire for cutting magnets into pieces or blocks

Diamond wire for cutting silicon and semiconductor materials

Diamond wire for cutting sapphire, magnets, and glass

Technical Parameters

SPEC	Wire diameter (μm)	Busbar Diameter (μm)	Breaking tension (N)	Application Areas
Φ55	70±5	55±2	≥11	Semiconductor material cutting
Φ60	75±5	60±2	≥13
Φ70	80±5	70±2	≥17
Φ80	90±5	80±2	≥20
Φ90	100±5	90±2	≥28
Φ100	110±5	100±2	≥30
Φ110	120±5	110±2	≥34
Φ80	80±5	60±2	≥13	Rare earth magnets, optical glass, silicon carbide cutting
Φ90	90±5	70±2	≥17
Φ100	110±5	80±2	≥22
Φ110	115±5	85±2	≥22
Φ120	120±5	90±2	≥28
Φ140	145±5	100±2	≥30
Φ150	150±10	110±2	≥35
Φ160	160±10	110±2	≥35
Φ170	170±10	120±3	≥40
Φ180	180±10	125±3	≥44
Φ190	190±10	135±3	≥50
Φ200	200±10	140±3	≥55
Φ220	220±10	160±3	≥70
Φ230	230±10	170±3	≥75	Functional ceramics, alloy materials, sapphire cutting
Φ250	250±10	180±3	≥88
Φ270	270±20	200±3	≥130
Φ300	300±20	240±3	≥160	Crystalline Silicon, Jade, Sapphire Open Square Truncation
Φ350	350±20	260±3	≥185
Φ380	380±25	300±3	≥230
Φ450	450±25	350±3	≥300

Note: 1. Special specifications can be customized according to customer needs; 2. The actual parameter values shall prevail based on the standards determined by both parties.

Material Applications

Semiconductor

Microcrystalline Glass

Sapphire

Silicon Carbide Crystals

Rare Earth Materials

Frequently Asked Questions

What are the primary advantages of diamond wire cutting?

Diamond wire cutting offers significantly higher efficiency (up to 3x faster), better precision, reduced material waste, and is more environmentally friendly as it eliminates the need for mortar.

Which materials can be processed with this diamond wire?

It is ideal for cutting a wide range of hard and brittle materials including semiconductors, silicon carbide, sapphire, rare earth magnets, optical glass, and functional ceramics.

Can I request custom specifications for the diamond wire?

Yes, we can customize special specifications, including wire diameter and busbar diameter, to meet specific customer requirements and application needs.

How does diamond wire cutting reduce production costs?

By utilizing diamond wire, investment in fixed assets for cutting equipment can be reduced by more than 50% for the same production capacity, while also lowering waste treatment costs.

What is the typical range of wire diameters available?

Our standard specifications range from Φ55μm for high-precision semiconductor cutting up to Φ450μm for large-scale crystalline silicon and jade truncation.

Is the process environmentally friendly?

Yes, the process is designed for environmental protection by eliminating mortar, which simplifies the waste treatment process and reduces the environmental footprint.