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Premium Diamond Wire Cutting Tools from China Suppliers - High-Precision Multi-Wire Factory for Superior Performance
Product Features
01
High Efficiency
Achieves cutting efficiency more than three times that of traditional cutting methods, significantly reducing cutting time.
02
Environmental Protection
Eliminates the need for mortar, simplifying the waste treatment process and enhancing environmental friendliness.
03
High Precision
Ensures a high yield of finished products with exceptional processing precision.
04
Cost Reduction
Lowers investment in fixed assets, reducing the required investment in cutting equipment by more than 50% for the same capacity.
Diamond wire for cutting magnets to cut magnets into pieces or blocks
Diamond wire for cutting silicon and semiconductor materials into straight sheets
Diamond wire for cutting sapphire, magnets, glasses into straight sheets
Technical Parameters
| SPEC | Wire diameter（μm） | Busbar Diameter（μm） | Breaking tension（N） | Application Areas |
| Φ55 | 70±5 | 55±2 | ≥11 | Semiconductor material cutting |
| Φ60 | 75±5 | 60±2 | ≥13 | |
| Φ70 | 80±5 | 70±2 | ≥17 | |
| Φ80 | 90±5 | 80±2 | ≥20 | |
| Φ90 | 100±5 | 90±2 | ≥28 | |
| Φ100 | 110±5 | 100±2 | ≥30 | |
| Φ110 | 120±5 | 110±2 | ≥34 | |
| Φ80 | 80±5 | 60±2 | ≥13 | Rare earth magnets, optical glass, silicon carbide cutting |
| Φ90 | 90±5 | 70±2 | ≥17 | |
| Φ100 | 110±5 | 80±2 | ≥22 | |
| Φ110 | 115±5 | 85±2 | ≥22 | |
| Φ120 | 120±5 | 90±2 | ≥28 | |
| Φ140 | 145±5 | 100±2 | ≥30 | |
| Φ150 | 150±10 | 110±2 | ≥35 | |
| Φ160 | 160±10 | 110±2 | ≥35 | |
| Φ170 | 170±10 | 120±3 | ≥40 | |
| Φ180 | 180±10 | 125±3 | ≥44 | |
| Φ190 | 190±10 | 135±3 | ≥50 | |
| Φ200 | 200±10 | 140±3 | ≥55 | |
| Φ220 | 220±10 | 160±3 | ≥70 | |
| Φ230 | 230±10 | 170±3 | ≥75 | Functional ceramics, alloy materials, sapphire cutting |
| Φ250 | 250±10 | 180±3 | ≥88 | |
| Φ270 | 270±20 | 200±3 | ≥130 | |
| Φ300 | 300±20 | 240±3 | ≥160 | Crystalline Silicon, Jade, Sapphire Open Square Truncation |
| Φ350 | 350±20 | 260±3 | ≥185 | |
| Φ380 | 380±25 | 300±3 | ≥230 | |
| Φ450 | 450±25 | 350±3 | ≥300 | |
| Note: 1, according to customer needs can be customized special specifications; 2, the actual value of the parameters of the specifications to the two sides to determine the standard shall prevail | ||||
Semiconductor
Microcrystalline Glass
Sapphire
Silicon Carbide Crystals
Rare Earth Materials
Frequently Asked Questions
What are the primary benefits of using this diamond wire?
The diamond wire offers three times the efficiency of traditional methods, higher precision, reduced equipment investment costs, and is environmentally friendly as it eliminates the need for mortar.
Which materials can be processed with your diamond wire?
It is suitable for a wide range of materials including semiconductors, rare earth magnets, optical glass, silicon carbide crystals, sapphire, functional ceramics, and jade.
What is the range of wire diameters available?
Our technical specifications range from Φ55μm for high-precision semiconductor cutting up to Φ450μm for crystalline silicon and jade truncation.
How does diamond wire reduce production costs?
By achieving the same production capacity with over 50% less investment in cutting equipment and reducing waste through higher precision and yield.
Are customized specifications available?
Yes, we can customize special specifications according to specific customer requirements and application needs.
What is the breaking tension of the Φ100 wire?
For semiconductor material cutting, the Φ100 wire has a breaking tension of ≥30N, while for rare earth magnets, it is ≥22N depending on the busbar diameter.