English
English French German Portuguese Spanish Russian Japanese Korean Arabic Turkish Italian Indonesian Polish Hindi Dutch Malay Persian Thai Vietnamese
Leave Your Message
High-Precision Multi-Wire Cutting: Premium Diamond Wire from China Suppliers and Factory for Superior Performance
Hot Products
Diamond-Wire.jpg
Diamond-Wire2.jpg

High-Precision Multi-Wire Cutting: Premium Diamond Wire from China Suppliers and Factory for Superior Performance

,

Diamond Wire is a high-performance cutting tool, expertly designed by bonding premium diamond particles to high carbon steel wire with a metal binding agent. This innovative product is particularly effective for processing hard and brittle materials, including silicon, semiconductor wafers, sapphire, rare-earth permanent magnets, alloys, and luxurious stones. Our Diamond Wire finds extensive applications across various industries in China, including aerospace, photovoltaic, semiconductor, LED, 3C (computers, communications, and consumer electronics), and precision optics.

,

Manufactured in our state-of-the-art factory using top-quality, high-concentration diamond micro-powder and high carbon steel wire sourced from Japan, our diamond wire guarantees outstanding performance and consistent quality. This cutting tool boasts rapid cutting speeds, exceptional processing precision, and minimal cutting loss. Furthermore, it contributes to a green and eco-friendly production environment, making it a preferred choice for suppliers seeking reliable and sustainable solutions.

,
    Contact Us
    Product Detail

    Product Features

    image001
    7 Jan 2019
    • High Efficiency: Achieves cutting efficiency more than three times that of traditional cutting methods, significantly reducing cutting time.
    • Environmental Protection: Eliminates the need for mortar, simplifying the waste treatment process and enhancing environmental friendliness.
    • High Precision: Ensures a high yield of finished products with exceptional processing precision.
    • Cost Reduction: Lowers investment in fixed assets, reducing the required investment in cutting equipment by more than 50% for the same capacity.
    image003

    Diamond wire for cutting magnets to cut magnets into pieces or blocks

    image004

    Diamond wire for cutting silicon to cut silicon and semiconductor materials into straight sheets

    image005

    Diamond wire for cutting sapphire to cut sapphire, magnets, glasses into straight sheets

    Technical Parameters

    SPEC Wire diameter（μm） Busbar Diameter（μm） Breaking tension（N） Application Areas
    Φ55 70±5 55±2 ≥11 Semiconductor material cutting
    Φ60 75±5 60±2 ≥13
    Φ70 80±5 70±2 ≥17
    Φ80 90±5 80±2 ≥20
    Φ90 100±5 90±2 ≥28
    Φ100 110±5 100±2 ≥30
    Φ110 120±5 110±2 ≥34
    Φ80 80±5 60±2 ≥13 Rare earth magnets, optical glass, silicon carbide cutting
    Φ90 90±5 70±2 ≥17
    Φ100 110±5 80±2 ≥22
    Φ110 115±5 85±2 ≥22
    Φ120 120±5 90±2 ≥28
    Φ140 145±5 100±2 ≥30
    Φ150 150±10 110±2 ≥35
    Φ160 160±10 110±2 ≥35
    Φ170 170±10 120±3 ≥40
    Φ180 180±10 125±3 ≥44
    Φ190 190±10 135±3 ≥50
    Φ200 200±10 140±3 ≥55
    Φ220 220±10 160±3 ≥70
    Φ230 230±10 170±3 ≥75 Functional ceramics, alloy materials, sapphire cutting
    Φ250 250±10 180±3 ≥88
    Φ270 270±20 200±3 ≥130
    Φ300 300±20 240±3 ≥160 Crystalline Silicon, Jade, Sapphire Open Square Truncation
    Φ350 350±20 260±3 ≥185
    Φ380 380±25 300±3 ≥230
    Φ450 450±25 350±3 ≥300
    Note: 1, according to customer needs can be customized special specifications; 2, the actual value of the parameters of the specifications to the two sides to determine the standard shall prevail
    image006_03

    Semiconductor

    image006_05

    Microcrystalline Glass

    image006_07

    Sapphire

    image006_09

    Silicon Carbide Crystals

    image006_11

    Rare Earth Materials

    Frequently Asked Questions

    What are the main advantages of this diamond wire cutting method?
    This cutting method offers high efficiency (more than three times traditional methods), environmental protection (no mortar required), exceptional processing precision for high yield, and significant cost reduction.
    How does the diamond wire reduce production costs?
    It lowers investment in fixed assets by reducing the required investment in cutting equipment by more than 50% for the same production capacity.
    What materials can be cut using this diamond wire?
    It is widely used for cutting semiconductors, rare earth magnets, optical glass, silicon carbide crystals, sapphire, functional ceramics, alloy materials, crystalline silicon, and jade.
    Can the specifications of the diamond wire be customized?
    Yes, special specifications can be customized according to customer needs. The actual value of the parameters will be determined and agreed upon by both parties.
    What is the wire diameter range available?
    The wire diameter ranges from 70±5 μm (for Φ55 specifications) up to 450±25 μm (for Φ450 specifications) depending on the application area.
    Why is this cutting process considered environmentally friendly?
    It eliminates the need for mortar during the cutting process, which simplifies waste treatment and significantly enhances environmental friendliness.

    Leave Your Message