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Premium Diamond Wire for High-Precision Multi-Wire Cutting

Diamond Wire is a high-performance cutting tool created by bonding diamond particles to high carbon steel wire using a metal binding agent. It is widely utilized in the processing of hard and brittle materials such as silicon, semiconductor wafers, sapphire, rare-earth permanent magnets, alloys, luxury stones, and high-end stones. Its applications span various industries, including aerospace, photovoltaic, semiconductor, LED, 3C (computers, communications, and consumer electronics), and precision optics.

Manufactured with high-quality, high-concentration diamond micro-powder and high carbon steel wire imported from Japan, our diamond wire ensures superior performance and strong quality consistency. The wire offers fast cutting speeds, high processing precision, and low cutting loss. Additionally, it promotes a green and environmentally friendly production environment for our customers.

product details

Product Features

7 Jan 2019

High Efficiency: Achieves cutting efficiency more than three times that of traditional cutting methods, significantly reducing cutting time.

Environmental Protection: Eliminates the need for mortar, simplifying the waste treatment process and enhancing environmental friendliness.

High Precision: Ensures a high yield of finished products with exceptional processing precision.

Cost Reduction: Lowers investment in fixed assets, reducing the required investment in cutting equipment by more than 50% for the same capacity.

Diamond wire for cutting magnets to cut magnets into pieces or blocks

Diamond wire for cutting silicon to cut silicon and semiconductor materials into straight sheets

Diamond wire for cutting sapphire to cut sapphire, magnets, glasses into straight sheets

Technical Parameters

SPEC	Wire diameter（μm）	Busbar Diameter（μm）	Breaking tension（N）	Application Areas
Φ55	70±5	55±2	≥11	Semiconductor material cutting
Φ60	75±5	60±2	≥13
Φ70	80±5	70±2	≥17
Φ80	90±5	80±2	≥20
Φ90	100±5	90±2	≥28
Φ100	110±5	100±2	≥30
Φ110	120±5	110±2	≥34
Φ80	80±5	60±2	≥13	Rare earth magnets, optical glass, silicon carbide cutting
Φ90	90±5	70±2	≥17
Φ100	110±5	80±2	≥22
Φ110	115±5	85±2	≥22
Φ120	120±5	90±2	≥28
Φ140	145±5	100±2	≥30
Φ150	150±10	110±2	≥35
Φ160	160±10	110±2	≥35
Φ170	170±10	120±3	≥40
Φ180	180±10	125±3	≥44
Φ190	190±10	135±3	≥50
Φ200	200±10	140±3	≥55
Φ220	220±10	160±3	≥70
Φ230	230±10	170±3	≥75	Functional ceramics, alloy materials, sapphire cutting
Φ250	250±10	180±3	≥88
Φ270	270±20	200±3	≥130
Φ300	300±20	240±3	≥160	Crystalline Silicon, Jade, Sapphire Open Square Truncation
Φ350	350±20	260±3	≥185
Φ380	380±25	300±3	≥230
Φ450	450±25	350±3	≥300
Note: 1, according to customer needs can be customized special specifications; 2, the actual value of the parameters of the specifications to the two sides to determine the standard shall prevail