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High-Precision Diamond Wire Cutting Tool from China Suppliers and Factory for Hard Materials Processing
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High-Precision Diamond Wire Cutting Tool from China Suppliers and Factory for Hard Materials Processing

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Our Diamond Wire cutting tool is a premium solution designed for high-performance applications. By bonding top-quality diamond particles to high carbon steel wire using a specialized metal binding agent, this cutting tool excels in processing hard and brittle materials, including silicon, semiconductor wafers, sapphire, rare-earth permanent magnets, and luxury stones. As a leading supplier and factory based in China, we cater to various industries such as aerospace, photovoltaic, semiconductor, LED, and precision optics.

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Crafted from high-concentration diamond micro-powder and high carbon steel wire sourced from Japan, our diamond wire cutting tools deliver exceptional performance and consistent quality. Users can experience fast cutting speeds, remarkable processing precision, and minimal cutting loss. Moreover, our commitment to green manufacturing ensures an environmentally friendly production process, making us the preferred choice for customers in need of advanced cutting solutions.

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    Product Detail

    Product Features

    Diamond wire cutting machine processing features
    01
    High Efficiency Achieves cutting efficiency more than three times that of traditional cutting methods, significantly reducing cutting time.
    02
    Environmental Protection Eliminates the need for mortar, simplifying the waste treatment process and enhancing environmental friendliness.
    03
    High Precision Ensures a high yield of finished products with exceptional processing precision.
    04
    Cost Reduction Lowers investment in fixed assets, reducing the required investment in cutting equipment by more than 50% for the same capacity.
    Diamond wire for cutting magnets into pieces or blocks

    Diamond wire for cutting magnets to cut magnets into pieces or blocks

    Diamond wire for cutting silicon and semiconductor materials

    Diamond wire for cutting silicon to cut silicon and semiconductor materials into straight sheets

    Diamond wire for cutting sapphire, magnets, glasses

    Diamond wire for cutting sapphire to cut sapphire, magnets, glasses into straight sheets

    Technical Parameters

    SPEC Wire diameter (μm) Busbar Diameter (μm) Breaking tension (N) Application Areas
    Φ55 70±5 55±2 ≥11 Semiconductor material cutting
    Φ60 75±5 60±2 ≥13
    Φ70 80±5 70±2 ≥17
    Φ80 90±5 80±2 ≥20
    Φ90 100±5 90±2 ≥28
    Φ100 110±5 100±2 ≥30
    Φ110 120±5 110±2 ≥34
    Φ80 80±5 60±2 ≥13 Rare earth magnets, optical glass, silicon carbide cutting
    Φ90 90±5 70±2 ≥17
    Φ100 110±5 80±2 ≥22
    Φ110 115±5 85±2 ≥22
    Φ120 120±5 90±2 ≥28
    Φ140 145±5 100±2 ≥30
    Φ150 150±10 110±2 ≥35
    Φ160 160±10 110±2 ≥35
    Φ170 170±10 120±3 ≥40
    Φ180 180±10 125±3 ≥44
    Φ190 190±10 135±3 ≥50
    Φ200 200±10 140±3 ≥55
    Φ220 220±10 160±3 ≥70
    Φ230 230±10 170±3 ≥75 Functional ceramics, alloy materials, sapphire cutting
    Φ250 250±10 180±3 ≥88
    Φ270 270±20 200±3 ≥130
    Φ300 300±20 240±3 ≥160 Crystalline Silicon, Jade, Sapphire Open Square Truncation
    Φ350 350±20 260±3 ≥185
    Φ380 380±25 300±3 ≥230
    Φ450 450±25 350±3 ≥300
    Note: 1. Special specifications can be customized according to customer needs; 2. The actual value of the parameters of the specifications agreed upon by both sides shall prevail.
    Semiconductor material cutting application

    Semiconductor

    Microcrystalline Glass cutting application

    Microcrystalline Glass

    Sapphire cutting application

    Sapphire

    Silicon Carbide Crystals cutting application

    Silicon Carbide Crystals

    Rare Earth Materials cutting application

    Rare Earth Materials

    Frequently Asked Questions

    What are the primary benefits of using diamond wire for cutting?
    Diamond wire cutting offers high efficiency (more than three times traditional methods), environmental protection (eliminating the need for mortar), exceptional processing precision for a high yield of finished products, and significant cost reduction by lowering fixed asset investments.
    What materials can be processed with this diamond wire?
    It is highly versatile and used for cutting semiconductor materials, silicon, sapphire, microcrystalline glass, silicon carbide crystals, rare earth materials, magnets, functional ceramics, alloy materials, and jade.
    How does diamond wire cutting reduce overall equipment investment?
    Due to its high efficiency and advanced cutting speed, the investment required for cutting equipment is reduced by more than 50% for the same production capacity compared to traditional cutting setups.
    Can special specifications for wire diameter and breaking tension be customized?
    Yes. Special specifications regarding wire diameter, busbar diameter, breaking tension, and application requirements can be customized according to specific customer needs.
    Why is diamond wire cutting considered environmentally friendly?
    Unlike traditional slurry or mortar-based cutting methods, diamond wire cutting eliminates the need for mortar. This simplifies the waste treatment process and reduces the environmental footprint of the manufacturing cycle.

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