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High-Precision Diamond Single Wire Cutting Equipment DCX800 - China Suppliers & Factory for Ultra-Hard Materials
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High-Precision Diamond Single Wire Cutting Equipment DCX800 - China Suppliers & Factory for Ultra-Hard Materials

Introducing the DCX800 Single-Wire Cutting Machine, a top-tier solution for China suppliers and factories seeking high-precision cutting capabilities for ultra-hard materials such as sapphire, optical glass, and jade. This cutting-edge machine utilizes a diamond-coated wire that oscillates during operation, effectively minimizing the cutting width and ensuring exceptionally clean and controlled separations. Its compact and robust design makes it an ideal choice for smaller production facilities and R&D labs, maximizing operational efficiency while maintaining accuracy. Upgrade your manufacturing process with the DCX800 and experience the difference in quality and precision that leading China suppliers trust

    Product Features

    Diamond Single Wire Cutting Equipment DCX8001
    7 Jan 2019
    Optimized Swing Cutting Technology: Reduces material waste by 15% with a patented diamond wire oscillation system, ideal for intricate cuts on fragile materials.
    Space-Saving Design: Tailored for workshops with limited floor space, featuring an 800x800x800mm workpiece capacity.
    Lab-Grade Precision: Integrated laser alignment sensors ensure ±0.05mm cutting accuracy, critical for optical components and electronics.
    Energy Efficiency: Consumes 20% less power than industry standards, lowering operational costs.
    Smart Error Recovery: Automatically resumes cutting after wire breaks, minimizing downtime.
    Applications: Semiconductor wafer dicing, custom jewelry and gemstone processing, and prototyping optical lenses or sensors.

    Technical Parameters

    Project Content Technical Parameters
    Model Model DCX800
    Processing capacity Max processing billet size 800×800×800mm
    Number of stations 1
    Workbench size 860X1200mm
    Diamond Wire Diamond wire diameter Ф0.25-φ0.60
    Max line storage capacity 20 km (φ0.25mm)
    Max round-trip routing speed 1200 m/min
    Cutting method Cutting method The cutting line drops in parallel or rocking down
    Max line swing angle ±30°
    Rotary cutting Rotating cutting, maximum sample size 8 inches, 360° rotation
    Cutting fluid Cutting fluid Water-based or oil-based cutting fluid
    Liquid storage capacity 223L
    Pump flow 200L/min
    Power supply Power supply 380V±10%、50Hz
    Power 15 Kw
    Dimensions and weight Dimensions (L x W x H) 2510 × 2700 × 2500 mm
    Weight 5000 Kg

    Frequently Asked Questions

    What is the maximum workpiece size the DCX800 can handle?
    The equipment features a large processing capacity with a maximum billet size of 800×800×800mm and a workbench size of 860X1200mm.
    What level of cutting precision can I expect?
    The DCX800 is designed for lab-grade precision, utilizing integrated laser alignment sensors to achieve a cutting accuracy of ±0.05mm.
    What types of diamond wire are compatible with this machine?
    It supports diamond wires with diameters ranging from Ф0.25 to φ0.60, with a maximum line storage capacity of up to 20 km for φ0.25mm wire.
    How does the swing cutting technology benefit the process?
    The patented diamond wire oscillation (swing) system allows for a maximum swing angle of ±30°, which reduces material waste by 15% and is ideal for fragile materials.
    What happens if the diamond wire breaks during operation?
    The machine is equipped with Smart Error Recovery, which allows it to automatically resume the cutting process after a wire break is resolved, significantly minimizing downtime.
    What are the power requirements for installation?
    The equipment requires a power supply of 380V±10% at 50Hz, with a total power consumption of 15 Kw.

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