Single Wire Saw
Diamond Single Wire Cutting Equipment DCX800
Product Features
01
7 Jan 2019
Optimized Swing Cutting Technology: Reduces material waste by 15% with a patented diamond wire oscillation system, ideal for intricate cuts on fragile materials.
Space-Saving Design: Tailored for workshops with limited floor space, featuring an 800x800x800mm workpiece capacity.
Lab-Grade Precision: Integrated laser alignment sensors ensure ±0.05mm cutting accuracy, critical for optical components and electronics.
Energy Efficiency: Consumes 20% less power than industry standards, lowering operational costs.
Smart Error Recovery: Automatically resumes cutting after wire breaks, minimizing downtime.
Applications: Semiconductor wafer dicing, custom jewelry and gemstone processing, and prototyping optical lenses or sensors.
Technical Parameters
|
Project |
Content |
Technical parameters |
|
Model |
Model |
DCX800 |
|
Processing capacity |
Max processing billet size |
800×800×800mm |
|
Number of stations |
1 |
|
|
Workbench size |
860X1200mm |
|
|
Diamond Wire |
Diamond wire diameter |
Ф0.25-φ0.60 |
|
Max line storage capacity |
20 km (φ0.25mm) |
|
|
Max round-trip routing speed |
1200 m/min |
|
|
Cutting method |
Cutting method |
The cutting line drops in parallel or rocking down |
|
Max line swing angle |
±30° |
|
|
Rotary cutting (with rotating tooling) |
Rotating cutting, maximum sample size 8 inches, 360° rotation |
|
|
Cutting fluid |
Cutting fluid |
Water-based or oil-based cutting fluid |
|
Liquid storage capacity |
223L |
|
|
Pump flow |
200L/min |
|
|
Power supply |
Power supply |
380V±10%、50Hz |
|
Power |
15 Kw |
|
|
Dimensions and weight |
Dimensions (L x W x H) |
2510 × 2700 ×2500 mm |
|
Weight |
5000 Kg |
