Products

The DA400 Multi-Wire Cutting Equipment is specifically engineered for the batch processing of super-hard and brittle materials such as sapphire, special ceramics, and silicon nitride into straight pieces.

Featuring a double-station design, this equipment achieves cutting of super-hard and brittle materials by swinging the workpiece, thereby reducing the cutting area efficiently.

The DA300/600 Multi-Wire Cutting Equipment is specifically designed for slicing super-hard and brittle materials such as sapphire and semiconductor silicon carbide. It is capable of processing diameters ranging from 4 to 8 inches and can achieve a maximum processing length of 300mm or 600mm.

Key advantages include low material loss, high processing quality, efficient cutting, and excellent stability.